LOCTITE® ABLESTIK 8008
旧名称 ABLECOAT 8008
特長および利点
LOCTITE ABLESTIK 8008, Proprietary Hybrid Chemistry, Die Attach
LOCTITE ABLESTIK 8008 snap curable adhesive is designed for small die sizes (<3mm). It exhibits moderate electrical and thermal conductivity. This material can be applied to a wafer backside by stencil printing and then B-staged in an oven. The adhesive can then be cured after die attach in an in-line process exhibiting a consistent, void-free bondline without bleed. LOCTITE ABLESTIK 8008 should be used with a pressure sensitive dicing tape and is not compatible with UV dicing tapes.
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技術情報
| RTダイせん断強度 | 6.0 kg-f |
| アプリケーション(用途) | ダイ接着剤 |
| ホットダイせん断強さ | 2.6 kg-f |
| 引張係数, @ 250.0 °C | 1800.0 N/mm² (261070.0 psi ) |
| 抽出可能なイオン含有量, ナトリウム(Na+) | 4.0 ppm |
| 抽出可能なイオン含有量, 塩化物 (CI-) | 4.0 ppm |
| 熱膨張率 | 42.0 ppm/°C |
| 硬化タイプ | 熱硬化 |
LOCTITE® ABLESTIK 8008
LOCTITE ABLESTIK 8008, Proprietary Hybrid Chemistry, Die Attach