LOCTITE® ABLESTIK ABP 8068TI - Syringe
Features and Benefits
Product image in this size is not available.
Available sizes:
This 1-part, low-temperature curing, dispensable die-attach adhesive is designed for high thermal and electrical lead frame packaging.
LOCTITE® ABLESTIK ABP 8068TI is a silver-filled, pressure-less sintering die-attach adhesive for semiconductor packages that require high thermal and electrical conductivity. It’s particularly used for QFN, LGA and HBLED packaging in automotive and industrial applications and shows excellent sintering properties when used on Ag, Au and PPF lead frames. LOCTITE ABLESTIK ABP 8068TI has been shown to provide better thermal performance than solder paste. It’s formulated with an epoxy-assisted sintering technology, cures when exposed to heat and produces a void-free bond line.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
LOCTITE® ABLESTIK ABP 8068TI
This 1-part, low-temperature curing, dispensable die-attach adhesive is designed for high thermal and electrical lead frame packaging.