LOCTITE® ABLESTIK ABP 8068TI
Features and Benefits
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This 1-part, low-temperature curing, high-performance, dispensable die attach material for high thermal and electrical lead frame packaging is ideal for automotive and industrial applications.
LOCTITE® ABLESTIK ABP 8068TI is a silver-filled, pressureless sintering die attach adhesive specially designed for semiconductor packages with high thermal and electrical requirements. This material’s epoxy-assisted sintering formulation is designed to provide high adhesion, high thermal, and low stress properties: essential for thermal and reliability performances of high-end power packages. It offers a void-free bondline, and has shown a better thermal performance compared to a solder paste material. You can expect excellent sintering properties when used on Ag, Au and PPF leadframe.
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LOCTITE® ABLESTIK ABP 8068TI
This 1-part, low-temperature curing, high-performance, dispensable die attach material for high thermal and electrical lead frame packaging is ideal for automotive and industrial applications.