LOCTITE® ABLESTIK ABP 8068TI
Features and Benefits
Available sizes:
This 1-part, low-temperature curing, dispensable die-attach adhesive is designed for high thermal and electrical lead frame packaging.
LOCTITE® ABLESTIK ABP 8068TI is a silver-filled, pressure-less sintering die-attach adhesive for semiconductor packages that require high thermal and electrical conductivity. It’s particularly used for QFN, LGA and HBLED packaging in automotive and industrial applications and shows excellent sintering properties when used on Ag, Au and PPF lead frames. LOCTITE ABLESTIK ABP 8068TI has been shown to provide better thermal performance than solder paste. It’s formulated with an epoxy-assisted sintering technology, cures when exposed to heat and produces a void-free bond line.
- Offers low stress
- High reliability
- Void-free bond line
- Good toughness
- Excellent workability and sintering properties
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Additional Documents
LOCTITE® ABLESTIK ABP 8068TI
This 1-part, low-temperature curing, dispensable die-attach adhesive is designed for high thermal and electrical lead frame packaging.