LOCTITE ABLESTIK ABP 2030SCR

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LOCTITE ABLESTIK ABP 2030SCR, Proprietary Hybrid Chemistry, Die Attach, Conductive Adhesive
LOCTITE® ABLESTIK ABP 2030SCR conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimize stress and resulting warpage between dissimilar surfaces. It can be used in a variety of package sizes.
  • Low stress
  • Low moisture uptake
  • Solvent-free
  • Low halogen content
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LOCTITE ABLESTIK ABP 2030SCR
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Informasi Teknis

Aplikasi Pelekat Die
Indeks Tiksotropik 5.0
Konduktivitas Termal 2.0 W/mK
Tipe Pengeringan Heat Cure
Viskositas, Brookfield CP51, @ 25.0 °C Speed 5 rpm 15000.0 mPa.s (cP)