LOCTITE ABLESTIK 8200T
fitur dan keuntungan
LOCTITE ABLESTIK 8200T, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK 8200T electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages.
- Excellent adhesion to Ag plated LF
- Snap curable
- Low bleed
- Oven Curable
Dokumen dan Unduhan
Mencari TDS atau SDS dalam bahasa lain?
Informasi Teknis
| Aplikasi | Pelekat Die |
| Kekuatan Geser Die Panas | 7.0 kg-f |
| Kekuatan Geser Die RT | 10.0 kg-f |
| Koefisien Muai Termal (CTE) | 61.0 ppm/°C |
| Konten Ionik yang Dapat Diekstrak, Kalium (K+) | 29.0 ppm |
| Konten Ionik yang Dapat Diekstrak, Klorida (Cl-) | 9.0 ppm |
| Konten Ionik yang Dapat Diekstrak, Natrium (Na+) | 9.0 ppm |
| Modulus Tensil, @ 250.0 °C | 2921.0 N/mm² (423655.0 psi ) |
| Tipe Pengeringan | Heat Cure |
LOCTITE ABLESTIK 8200T
LOCTITE ABLESTIK 8200T, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive