LOCTITE® CB 3626MHF

Features and Benefits

LOCTITE CB 3626MHF, Epoxy, Component assembly, NCA, Surface mount adhesive
LOCTITE® CB 3626MHF is designed for bonding of surface mounted devices to printed circuit boards prior to wave soldering. This material is formulated to give excellent dot size and shape control when applied with a stencil using hand print or machine print process.
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Technical Information

Cure schedule, @ 130.0 °C 120.0 sec.
Cure type Heat cure
Number of components 1 part
Physical form Gel
Shear strength, Steel (grit blasted) 2610.0 psi
Storage temperature 2.0 - 8.0 °C