Room Temperature Stable Solder Paste - the Continuing Success Story One year ago we introduced the groundbreaking room temperature stable solder paste LOCTITE GC 10, what's happened in the previous year, and where we are headed now. This presentation will highlight how we have successfully introduced this room temperature stable chemistry to customers and the benefits achieved in the real-life process window improvements we've been able to give to them. We will also look at the new and exciting developments we are working on now, and how we are focused on making the future even easier via the launch of next-generation products which complement and enhance our range of room temperature stable products. Author: Richard Boyle Read More
Game Changing Room Temperature Stable Solder Paste A number of studies have shown that up to 60-80% of all electronics assembly defects are related to the solder paste printing and reflow characteristics. Since the introduction of lead-free solder paste, manufacturers have concentrated on improving the printing performance and widening the reflow window, but the number one problem in assembly of circuit boards still point to the solder paste. While some of these defects can be blamed on environmental elements, temperature, humidity on the factory floor or possible temperature variations during the shipping and handling. The condition of the paste, while fresh is usually good, but many of the process defects may be attributed to the logistics of getting material from the vendors to the shop floor. Henkel will explore in this webinar the effects of shelf life and manufacturing environment effects on solder paste. Author: Dr. Neil Poole Ph.D. Read More