A number of studies have shown that up to 60-80% of all electronics assembly defects are related to the solder paste printing and reflow characteristics. Since the introduction of lead-free solder paste, manufacturers have concentrated on improving the printing performance and widening the reflow window, but the number one problem in assembly of circuit boards still point to the solder paste. While some of these defects can be blamed on environmental elements, temperature, humidity on the factory floor or possible temperature variations during the shipping and handling. The condition of the paste, while fresh is usually good, but many of the process defects may be attributed to the logistics of getting material from the vendors to the shop floor. Henkel will explore in this webinar the effects of shelf life and manufacturing environment effects on solder paste.
Author: Dr. Neil Poole Ph.D.