BERGQUIST® GAP PAD® TGP 5000
Γνωστό ως Gap Pad® 5000S35
Χαρακτηριστικά και οφέλη
Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with fiberglass to protect against punctures, and improved shear and tear resistance and with natural tack on both sides, this product is easy to handle and is ideal for high performance applications at low mounting pressures. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
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Έγγραφα και λήψεις
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Τεχνικές πληροφορίες
| Αξιολόγηση μετάδοσης φλόγας | V-0 |
| Διηλεκτρική Σταθερά, @ 1kHz | 7.5 |
| Ειδική αντίσταση διόγκωσης | 1×10 Ohm m |
| Θερμική αγωγιμότητα | 5.0 W/mK |
| Θερμική ισχύς, ASTM E1269 | 1.0 J/g-K |
| Θερμοκρασία λειτουργίας | -60.0 - 200.0 °C |
| Πυκνότητα | 3.6 g/cm³ |
| Σκληρότητα Shore, Thirty second delay value, ASTM D2240 Χύδην καουτσούκ Shore 00 | 35.0 |
| Τάση διάτρησης | 5000.0 Vac |
| Τυπικό πάχος | 0.508 - 3.175 mm |
| Χρώμα | Ανοιχτό πράσινο |
BERGQUIST® GAP PAD® TGP 5000
Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.