BERGQUIST® GAP PAD® TGP 5000

Známé jako Gap Pad® 5000S35

Vlastnosti a výhody

Thermally conductive, silicone-based, fiberglass-reinforced gap pad filler with a high thermal conductivity rating of 5.0 W/m-K.
BERGQUIST® GAP PAD TGP 5000 is a highly conformable material with natural inherent tack, which reduces interface thermal resistance. Due to the highly flexible and elastic nature of the material, it easily conforms to unique contours while maintaining structural integrity and without applying stress to fragile components. Reinforced with fiberglass to protect against punctures, and improved shear and tear resistance and with natural tack on both sides, this product is easy to handle and is ideal for high performance applications at low mounting pressures. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
Oblasti Použití

Technické informace

Barva Světle zelená
Dielektrická konstanta, @ 1kHz 7.5
Hodnocení hořlavosti V-0
Hustota 3.6 g/cm³
Objemový odpor 1×10 Ohm m
Provozní teplota -60.0 - 200.0 °C
Průrazné napětí dielektrika 5000.0 Vac
Standardní tloušťka 0.508 - 3.175 mm
Tepelná kapacita, ASTM E1269 1.0 J/g-K
Tepelná vodivost 5.0 W/mK
Tvrdost v jednotce shore, Thirty second delay value, ASTM D2240 Sypká pryž Shore 00 35.0