BERGQUIST® GAP PAD® TGP 2101SF
Γνωστό ως Gap Pad® 2101SF
Χαρακτηριστικά και οφέλη
BERGQUIST GAP PAD TGP 2101SF, Thermally Conductive, Silicone-Free Gap Filling Material
BERGQUIST® GAP PAD TGP 2101SF is a silicone-free, high performance, thermally conductive gap filling material. The material offers high thermal performance (2.0 W/mK) and is designed for silicone-sensitive applications. BERGQUIST GAP PAD TGP 2101SF is reinforced for easy material handling and added durability during assembly. BERGQUIST GAP PAD TGP 2101SF offers exceptionally low interfacial resistances to adjacent surfaces and is constructed using a 1 mil polyester film on one side and natural tack on the other . The 1 mil polyester film provides a tack-free surface that can be utilized to slide the pad or component into position during assembly.
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Έγγραφα και λήψεις
Ψάχνετε για TDS ή SDS σε άλλη γλώσσα;
Τεχνικές πληροφορίες
| Θερμική αγωγιμότητα | 2.0 W/mK |
| Θερμοκρασία λειτουργίας | -60.0 - 125.0 °C |
| Μέτρο Υoung, ASTM D575 | 228.0 KPa (33.0 psi ) |
| Τυπικό πάχος | 0.254 - 3.175 mm |
| Τύπος μεταφοράς | Πολυεστέρας |
| Χρώμα | Πράσινο |
BERGQUIST® GAP PAD® TGP 2101SF
BERGQUIST GAP PAD TGP 2101SF, Thermally Conductive, Silicone-Free Gap Filling Material