BERGQUIST® HI FLOW THF 1600P

Known as Hi-Flow® 300P

Features and Benefits

A high performance, electrically insulating, thermally conductive phase change material with polymide reinforcement - designed for electronic power devices requiring electrical isolation to the heat sink. No spill, no mess, easy handling.
BERGQUIST® HI FLOW THF 1600P is an electrically insulating, thermally-conductive 55°C (131°F) phase reinforced change material with high temperature reliability (150°C / 302°F). Its polymide film provides high dielectric strength and cut-through resistance while achieving superior values in thermal performance and voltage breakdowns. The easy-release liner provides excellent handling in high volume assemblies. This product is ideal for use as a thermal interface material between electronic power devices that require electrical isolation to the heat sink.
  • Thermal impedance: 0.13°C (32°F) in2/W @ 25 psi
  • Outstanding thermal performance in an insulated pad
  • Excellent cut-through resistance
  • Excellent dielectric performance
  • Phase change softening temp 55°C (131°F)
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Technical Information

Carrier type Polyimide
Color Green
Flame rating V-0
Operating temperature 150.0 °C
Standard thickness 0.102 - 0.127 mm
Thermal conductivity 1.6 W/mK

Frequently Asked Questions