BERGQUIST® GAP PAD® TGP 1000HD

功能与优点

BERGQUIST GAP PAD TGP 1000HD is a silicone based, thermally conductive gap filler which is designed to be highly durable (HD) and allows rework.
BERGQUIST® GAP PAD TGP 1000HD is a silicone based, thermally conductive and highly durable gap filler. It is coated with a robust polyimide carrier on one side which allows easy rework, easy handling and puncture resistance. This product is highly conformable and therefore allows excellent interfacing even to surfaces with high degree of roughness.
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技术信息

导热性 1.0 W/mK
操作温度 -60.0 - 180.0 °C
标准厚度 0.508 - 3.175 mm
载体类型 聚酰亚胺
颜色 深灰色

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