BERGQUIST® HI FLOW THF 5000UT Specially designed for the Data & Telecom Market
功能与优点
A breakthrough, unreinforced, thermally-conductive phase-change material designed for challenging designs in advanced computer and networking applications, offering superior thermal performance. With thin bond lines and low thermal impedance at both very low pressure (< 10 psi) and at higher pressure (> 35 psi), the formulation delivers excellent thermal capability while minimizing stress.
BERGQUIST® HI FLOW THF 5000UT is a multi award-winning reworkable phase change thermal interface material designed for use between a heat sink and a variety of heat generating components. The material flows at its phase change temperature and conforms to the surface features of the components. During flow, air is expelled from the interface and thermal impedance is reduced, enabling highly efficient thermal transfer.
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技术信息
| 主要特性 | 传导性：导热, 可重装 |
BERGQUIST® HI FLOW THF 5000UT
A breakthrough, unreinforced, thermally-conductive phase-change material designed for challenging designs in advanced computer and networking applications, offering superior thermal performance. With thin bond lines and low thermal impedance at both very low pressure (< 10 psi) and at higher pressure (> 35 psi), the formulation delivers excellent thermal capability while minimizing stress.