LOCTITE® ABLESTIK ABP 8064T
Known as ABLESTIK ABP 8064T (44G)
Features and Benefits
LOCTITE ABLESTIK ABP 8064T, Hybrid chemistry, Die Attach
LOCTITE® ABLESTIK ABP 8064T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes.
- High thermal conductivity
- High electrical conductivity
- Medium modulus
- Low outgassing
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 47.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 9.0 ppm |
| Extractable ionic content, Potassium (K+) | 9.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Hot die shear strength | 5.6 psi |
| RT die shear strength | 12.18 kg-f |
| Tensile modulus, DMTA @ 250.0 °C | 1280.0 N/mm² (185505.0 psi ) |
LOCTITE® ABLESTIK ABP 8064T
LOCTITE ABLESTIK ABP 8064T, Hybrid chemistry, Die Attach