BERGQUIST® GAP FILLER TGF 2200 APS

BERGQUIST® GAP FILLER TGF 2200 APS is a two component, thermally conductive silicone based liquid gap filler. This product is designed for applications that require low density for light weighting and high thermal conductivity to provide optimum thermal performance. It can be dispensed with minimum effort due to its optimised shear thinning characteristics. It exhibits excellent low and high temperature mechanical and chemical stability. It is therefore ideal for use in Automotive power storage (APS) applications.