LOCTITE® ABLESTIK QMI529HT-2A1
Características e Benefícios
This electrically conductive adhesive works well for high throughput die attach applications. Expect high accuracy and a controlled bondline.
For continuous high resistance to delamination and popcorning, choose LOCTITE® ABLESTIK QMI529HT-2A1. This high strength, hybrid technology, electrically conductive die attach adhesive is hydrophobic, and ideal for high accuracy applications with consistent bondline thickness for superior functionality. This product and its use may be covered by patent 5,716,034 and by one or more pending patent applications.
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Informação Técnica
| Aplicações | Cravação por afundamento |
| Coeficiente de expansão térmica (CTE) | 53.0 ppm/°C |
| Coeficiente de expansão térmica (CTE), Above Tg | 156.0 ppm/°C |
| Condutividade térmica | 6.0 W/mK |
| Temperatura de transição do vidro (Tg) | 3.0 °C |
| Tipo de cura | Cura por Calor |
| Viscosidade | 185000.0 mPa.s (cP) |
| Índice tixotrópico | 4.8 |
LOCTITE® ABLESTIK QMI529HT-2A1
This electrically conductive adhesive works well for high throughput die attach applications. Expect high accuracy and a controlled bondline.