LOCTITE® ABLESTIK QMI529HT-2A1
Caractéristiques et avantages
This electrically conductive adhesive works well for high throughput die attach applications. Expect high accuracy and a controlled bondline.
For continuous high resistance to delamination and popcorning, choose LOCTITE® ABLESTIK QMI529HT-2A1. This high strength, hybrid technology, electrically conductive die attach adhesive is hydrophobic, and ideal for high accuracy applications with consistent bondline thickness for superior functionality. This product and its use may be covered by patent 5,716,034 and by one or more pending patent applications.
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Informations techniques
| Applications | Soudage de puce |
| Coefficient de dilatation thermique (CDT) | 53.0 ppm/°C |
| Coefficient de dilatation thermique (CDT), Above Tg | 156.0 ppm/°C |
| Conductivité thermique | 6.0 W/mK |
| Indice thixotropique | 4.8 |
| Température de transition vitreuse | 3.0 °C |
| Type de polymérisation | Polymérisation par la chaleur |
| Viscosité | 185000.0 mPa.s (cP) |
LOCTITE® ABLESTIK QMI529HT-2A1
This electrically conductive adhesive works well for high throughput die attach applications. Expect high accuracy and a controlled bondline.