Low Pressure Molding

Electronic components need to be protected against moisture, chemical exposure and high temperatures, but standard production cycles with bonding and encapsulation takes time and have design limitation. 

TECHNOMELT^® and LOCTITE^® low pressure molding material solutions from Henkel offer streamlined processing and excellent protection for Medical, Electronic Components, Power & Industrial Automation, HVAC and Lighting applications.LOCTITE^® low pressure molding materials have been tested to Henkel’s protocols based upon ISO-10993 biocompatibility standards, with certificates available on request. The simplicity of these products is their advantage: the entire Henkel operation takes place at low pressure, cycle time is short, and fine or fragile circuitry is not damaged. For these reasons, TECHNOMELT^® and LOCTITE^® are increasingly being chosen as an alternatives to encapsulating processes (e.g. potting) as well as conventional plastic housings.

Whether you are looking for polyamide or polyolefin hot melt adhesives, Henkel materials deliver exceptional electrical insulation, as well as temperature, vibration, and solvent resistance for modern connectors, electronic components, printed circuit boards (PCBs), lighting and medical applications. The broad product range protects electronics from the harshest environmental conditions, including high humidity, long-term UV exposure, and extreme thermal cycling. Henkel is a trusted supplier of high-quality low pressure molding materials that help protect electronic circuit boards and other components against various environmental pressures.

Contact us today to talk to our team of experts about our entire line of low pressure molding materials.

Examples of Low Pressure Molding

The TECHNOMELT^® and LOCTITE^® Low Pressure Molding Process

How does low pressure molding with TECHNOMELT^® and LOCTITE^® materials work? It's really simple, because you are able to encapsulate your electronic products in only three steps:

1. Insert bare electronics into your predesigned mold set
2. Henkel encapsulates electronics at low pressure and temperatures
3. Test parts and move them to final assembly — immediately after molding

Do you have questions about the Henkel line of low pressure molding materials? Contact a member of a team today and we will be happy to assist you. We offer specialized services for all low pressure molding systems and our team of experts are able to assist you with all your questions.

How does low pressure molding fit to traditional manufacturing methods, such as injection molding and potting? It is similar to plastic injection molding but operating at a lower pressure, which makes this manufacturing method perfect for electronic components. Compared to Potting, low pressure molding reduces manufacturing times significantly and less cleaning requirements are needed. 

Low Pressure Molding Materials

Henkel low pressure molding materials are specially designed for PCB protection while helping you cut cost and improve quality across different applications. Our low pressure molding compounds include thermoplastic polyamides and polyolefin hot melt adhesives suitable for different low pressure molding systems. Low pressure molding is a faster and more efficient process than conventional potting. Henkel is a one-part material that requires no mixing or curing and, therefore, reduces material consumption through streamlined, multi-level, and contour-exact encapsulation. This also constitutes a sustainable solution through its unique re-usable formulation and green chemistry. Integrating Henkel low pressure molding compounds as an alternative to potting also reduces part numbers by eliminating the need for housing or additional parts to achieve strain relief.

The Benefits of TECHNOMELT^® and LOCTITE^® low pressure molding

Success stories with TECHNOMELT^® and LOCTITE^® low pressure molding

As electronic device manufacturers continue to move toward more cost-effective and sustainable solutions, TECHNOMELT^® integration for viable protection of electronic components and systems is accelerating. Today, Henkel low pressure materials are used in a wide range of applications as for plugs and connectors, cable bunding, control units, monitors, sensors and many more. One example of where TECHNOMELT® was used is the recent lighting enhancement on a bridge in a major US city. TECHNOMELT^® was used to encase 25,000 LED circuit boards, protecting the sensitive LED electronics from the harsh geographic environment.

TECHNOMELT^® also was chosen to protect electronic controllers in the robot that capped a ruptured pipe in an infamous oil spill in the Gulf of Mexico. TECHNOMELT^® can be found in these high-visibility applications, as well as in products like coffee makers, self-driving cars, GPS tracking devices, and PC accessories. Find out more about the different industries and applications that use low pressure molding compounds:

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