LOCTITE® ECCOBOND F 112
Características y Ventajas
This low viscosity, 2-part non-conductive adhesive is specially formulated for fiber optic assembly applications. It is resistant to both thermal shock and impact.
If you’re looking for an electrically non-conductive adhesive for fiber optic assembly applications, try LOCTITE® ECCOBOND F 112. This 2-part low-viscosity product is thermal shock and impact resistant, and offers low stress connections with no pistoning. It’s also ideal for multimode and single mode connectors, and small potting and sealing applications.
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Información técnica
| Número de componentes | Bicomponente |
| Programa de curado, @ 25.0 °C | 1.0 h |
| Resistencia al corte, Aluminio | 3000.0 psi |
| Temperatura de almacenaje | 27.0 °C |
| Tipo de curado | Curado Térmico |
| Viscosidad, @ 25.0 °C | 1800.0 mPa.s (cP) |
| Índice tixotrópico | 1.0 |
LOCTITE® ECCOBOND F 112
This low viscosity, 2-part non-conductive adhesive is specially formulated for fiber optic assembly applications. It is resistant to both thermal shock and impact.