LOCTITE® ECCOBOND F 112
Caractéristiques et avantages
This low viscosity, 2-part non-conductive adhesive is specially formulated for fiber optic assembly applications. It is resistant to both thermal shock and impact.
If you’re looking for an electrically non-conductive adhesive for fiber optic assembly applications, try LOCTITE® ECCOBOND F 112. This 2-part low-viscosity product is thermal shock and impact resistant, and offers low stress connections with no pistoning. It’s also ideal for multimode and single mode connectors, and small potting and sealing applications.
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Informations techniques
| Indice thixotropique | 1.0 |
| Nombre de composants | Bi composant |
| Programme de durcissement, @ 25.0 °C | 1.0 hr. |
| Résistance au cisaillement, Aluminium | 3000.0 psi |
| Température de stockage | 27.0 °C |
| Type de polymérisation | Polymérisation par la chaleur |
| Viscosité, @ 25.0 °C | 1800.0 mPa.s (cP) |
LOCTITE® ECCOBOND F 112
This low viscosity, 2-part non-conductive adhesive is specially formulated for fiber optic assembly applications. It is resistant to both thermal shock and impact.