LOCTITE® ABLESTIK QMI519LB
Known as QMI519LB (20G)
Features and Benefits
LOCTITE ABLESTIK QMI519LB, BMI/Acrylate, Die Attach, Silver Filled Conductive Adhesive
LOCTITE® ABLESTIK QMI519LB silver filled conductive adhesive is recommended for use in bonding integrated circuits and components to metal leadframes. It is is designed to achieve UPHs several orders of magnitude higher than conventional oven cured adhesives. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heater or on the wirebonder preheater. Studies have also shown improved coplanarity in parts cured on the diebonder.
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Documents and Downloads
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 40.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 19.0 ppm |
| Extractable ionic content, Potassium (K+) | 19.0 ppm |
| Extractable ionic content, Sodium (Na+) | 19.0 ppm |
| RT die shear strength, 2 x 2 mm Si die on Au leadframe | 15.0 kg-f |
LOCTITE® ABLESTIK QMI519LB
LOCTITE ABLESTIK QMI519LB, BMI/Acrylate, Die Attach, Silver Filled Conductive Adhesive