BERGQUIST® GAP FILLER TGF 1500LVO
Features and Benefits
A thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Low volatile outgassing for silicone sensitive applications.
BERGQUIST® GAP FILLER TGF 1500LVO is a 1.5 W/m-K thermally conductive, ultra-conforming, silicone-based liquid gap filler (2-part). It offers high temperature resistance and is proven to have significantly lower levels of silicone outgassing. It cures at room temperature or can be accelerated using heat, and is ideal for fragile applications or those that don't require a strong bond due to a lower level of adhesion strength. This product is curable at room temperature. However, the cure rate can be accelerated with application of heat. For information on UL certifications for our Thermal Management Materials Portfolio, please refer to UL file No. E59150.
- Thermal conductivity: 1.8 W/mK
- Low volatility for outgassing and silicone sensitive applications
- Ultra-conforming, with excellent wet-out
- 100% solids — no cure by-products
Documents and Downloads
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Additional Documents
Technical Information
| Cure type | Heat cure |
| Flame rating | V-0 |
| Thermal conductivity | 1.8 W/mK |
| Mixed | |
| Color, Mixed | Yellow |
| Resin | |
| Color, Resin | Yellow |
| Hardener | |
| Color, Hardener | White |
BERGQUIST® GAP FILLER TGF 1500LVO
A thermally-conductive liquid gap filler for easy, precision dispensing and low stress assembly. Low volatile outgassing for silicone sensitive applications.