LOCTITE® ECCOBOND FIL 7010C
Features and Benefits
This low-viscosity 1-part epoxy product has a low thermal expansion and high Tg, and is specially designed for use as a potting or encapsulation resin protection for stress sensitive electronic components.
LOCTITE® ECCOBOND FIL 7010C is a low viscosity, 1-part epoxy product designed for use as a potting or encapsulation resin protection for stress sensitive electronic components. It is specially formulated with a low thermal expansion and high Tg, along with a toughened polymer backbone, making it ideally suited to survive severe thermal shock conditions. It has a high resistance to micro cracking and is designed to survive constant service temperatures of 150°C (302°F), with peak temperatures of up to 180°C (356°F).
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Additional Documents
Technical Information
| Color | Black |
| Cure type | Heat cure |
| Number of components | 1 part |
LOCTITE® ECCOBOND FIL 7010C
This low-viscosity 1-part epoxy product has a low thermal expansion and high Tg, and is specially designed for use as a potting or encapsulation resin protection for stress sensitive electronic components.