LOCTITE® ECCOBOND DAM 7010C
Features and Benefits
This product is formulated to be used in combination with LOCTITE ECCOBOND FIL 7010C as a dam encapsulant, and specially designed for glob top applications where protection of wire bonded bare IC is required.
LOCTITE® ECCOBOND DAM 7010C is formulated to be used in combination with a 'fill’ encapsulant LOCTITE ECCOBOND FIL 7010C as a dam encapsulant. It is specially designed for glob top applications where protection of wire bonded bare IC is required. This 2-part combination is also ideal for the protection of multiple chips and for encapsulating components where a well-defined glob height and flat surface are required.
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Technical Information
| Color | Black |
| Cure type | Heat cure |
| Number of components | 1 part |
LOCTITE® ECCOBOND DAM 7010C
This product is formulated to be used in combination with LOCTITE ECCOBOND FIL 7010C as a dam encapsulant, and specially designed for glob top applications where protection of wire bonded bare IC is required.