LOCTITE® ABLESTIK 8200C
Features and Benefits
LOCTITE ABLESTIK 8200C, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive
LOCTITE® ABLESTIK 8200C electrically conductive die attach adhesive is designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages.
Read More
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 60.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 130.0 ppm/°C |
| Colour | Silver |
| Cure schedule, @ 175.0 °C 30 min. ramp | 45.0 min. |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 9.0 ppm |
| Extractable ionic content, Potassium (K+) | 9.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| Glass transition temperature (Tg) | 190.0 °C |
| RT die shear strength, 3 x 3 mm Si die on SPCLF | 19.1 kg-f |
| Tensile modulus, DMTA @ 250.0 °C | 759.0 N/mm² (110000.0 psi ) |
| Thermal conductivity | 1.2 W/mK |
| Thixotropic index | 5.0 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11500.0 mPa·s (cP) |
| Volume resistivity | 0.00017 Ohm cm |
LOCTITE® ABLESTIK 8200C
LOCTITE ABLESTIK 8200C, Proprietary Hybrid Chemistry, Die Attach, Electrically Conductive Adhesive