LOCTITE® ECCOBOND E 1172 A
Features and Benefits
This 1-part, epoxy-based underfill encapsulant is designed for use on flip-chip devices with as small as 25 μm geometries.
LOCTITE® ECCOBOND E 1172 A is a void-free, epoxy-based underfill encapsulant designed for use on very fine area array devices where SMT transparent processing is critical. It can be used on flip-chip devices with as small as 25-micron geometries. When applied, it provides a uniform encapsulation with a strong adhesive force, maximizing the device's temperature cycling capability by distributing stress away from solder connects.
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Technical Information
| Cure schedule, @ 135.0 °C | 6.0 min. |
| Glass transition temperature (Tg) | 135.0 °C |
| Viscosity, Brookfield, Spindle 3, speed 5 rpm | 17000.0 mPa·s (cP) |
LOCTITE® ECCOBOND E 1172 A
This 1-part, epoxy-based underfill encapsulant is designed for use on flip-chip devices with as small as 25 μm geometries.