Ultra-High Temperature Resistant Bonding and Sealing Silicone Solutions Henkel continues to lead in Appliance & HVAC solutions, and today announced its latest innovations, UL 746C recognized silicones with 230C ratings which cure at room temperature and enable ultra-high temperature resistance and unmatched thermocycling performance. Read More
Sensor INKxperience Kit The new and innovative Henkel INKxperience Kit offers four different printed electronic technology sensors pre-configured with hardware and software for prototyping and engineering ideation. The kit is designed for professional engineers and developers to experiment with the technology of printed electronics for the development of IoT sensor solutions Read More
Unlocking New Possibilities Thinking Beyond: A Vision For Human Progress In a rapidly changing world of endless technological possibilities and need for adaptation, people's desire for meaning and value is stronger than ever. At Henkel, we believe: Progress should not be limited to a privileged few but should be inclusive, making our lives better. For all of us. That’s why we think beyond existing boundaries and routines, beyond adhesives, and even beyond products to achieve sustainable and human-centred progress that is accessible to everyone. Read More
Henkel Highlights Portfolio of Enabling Materials for Next-Gen Semiconductor Devices at Semicon Taiwan 2023 Taipei, Taiwan – At this week’s SEMICON Taiwan, Henkel brings its extensive range of semiconductor packaging material solutions to customers in a collaborative setting designed to foster discussions that will help address application challenges. With recently launched innovations for high-reliability advanced packaging and wirebond devices, the company will showcase its enabling impact on some of the most demanding package designs used in the automotive, industrial, and high-performance computing sectors. “As the SEMICON Taiwan show organizers have emphasized,” comments Henkel Global Market Segment Head for Semiconductor Packaging Materials, Ramachandran Trichur, “the semiconductor industry is central to nearly all technology development and to solving some of the world’s biggest challenges. Henkel is a key contributor to this progress, delivering cutting-edge semiconductor packaging materials for high reliability automotive packaging, AI and high-performance computing, and... Read More
First Low Temperature Cleaner for Efficient & Sustainable Aluminum Beverage Can Manufacturing The lower the temperature, the higher the impact! Read More
Henkel Debuts Ultra-High Thermal Conductivity Pressure-Less Sintering Die Attach Adhesive That Meets Automotive Grade Reliability Standards 165 W/m-K material well-suited for high-reliability power discrete packages used in automotive and industrial applications Read More
Henkel Delivers Versatile, High Thermal Die Attach Adhesive For Power IC Applications High thermal, 30 W/m-K Loctite Ablestik ABP 6395T formulation requires no sintering, material delivers design flexibility and automotive-grade reliability Read More
Fiber Expansion: No Signs of a Slowdown While supply chain challenges and inflationary pressures are putting a squeeze on many markets, the data access sector shows no signs of letting up; the installation of advanced systems to provide data delivery improvements is moving full-speed ahead. The infamous ‘the last mile’ – which has long been noted as a primary source of data delivery bottlenecks – stands to shed its former negative perceptions, with next-generation passive optical networks (PONs) significantly improving performance and bandwidth. As data traffic has exploded and demands for high-speed data access have accelerated, the PON, which delivers multi-user access to high-speed broadband signals from a single optical cable, is becoming increasingly more efficient and powerful. And its growth is notable, with 2021 showing a 12% gain in broadband access equipment revenue versus the prior year, according to a report by analyst Dell’Oro Group. Read More
Henkel Non-conductive Die Attach Film Offers Broad Wirebond Package Flexibility for High-reliability Applications Material Formulated for Lead Frame and Laminate Packages Across a Wide Die Size Range Read More