Dr. Sanjay Misra
Sr. Scientific Principal
Thermal interface materials (TIMs) are ubiquitous in electronics cooling in a wide variety of applications in Industrial, Automotive and Consumer electronics [1]. These materials are typically comprised of a soft polymeric matrix with thermally conductive fillers. By far the majority of TIMs are based on silicone polymers due to the special characteristics of thermal stability and ability to fine tune the modulus across a wide range [2]. Silicone migration concerns – both with vapor phase (outgassing) and liquid phase (bleed) have been of concern (although not always accompanied by specifics). With proper analysis of the application these concerns can be addressed by designing materials specifically for such applications. Migration is dependent on both TIM microstructure and application details like power density, thermal stack up and physical layouts. We will describe the underlying cause of polymer migration, possible risks, and mitigation measures. Download the whitepaper to learn more.
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