Electronics Protection Simplicity

 With our expert Jochen Schilling

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In this episode, we talk about how low-pressure molding is shaping device resilience. In the world of industrial device manufacturing, complexity often drives innovation. However, when it comes to protecting electronic components, simplicity prevails with low pressure molding. This straightforward, three-step encapsulation technique offers superior resilience for electronics in various sectors, including industrial automation, automotive, medical, and lighting. By utilizing specialized polyamide hot melt materials and custom molds, low pressure molding provides quick, robust, and delicate protection without the need for high pressure. Discover how this innovative process is transforming device durability and efficiency across industries.

Listen to the podcast and/or read the article to learn more.

About the Guest Speaker

Jochen brings over two decades of invaluable experience working as project engineer and technical customer service. For more than 10 years in the automotive industry, he supported development of materials for acoustical and structural parts, where he focused on enhancing product quality and performance. Currently serving as an application engineer for hotmelt technology and low-pressure molding applications within the Industrials business unit of Henkel Adhesive Technologies, Jochen is dedicated to supporting global and regional key accounts. In his role, he oversees segments such as cable & components and general manufacturing, where his deep understanding of materials and processes allows him to provide innovative solutions tailored to each client's unique needs. Passionate about customer satisfaction, Jochen is committed to engaging early in the design phase to ensure maximum value from material solutions and processes. His proactive approach and dedication to excellence make him a trusted partner for clients seeking optimal performance and efficiency in industrial and electronics manufacturing.

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