In this episode, we talk about how low-pressure molding is shaping device resilience. In the world of industrial device manufacturing, complexity often drives innovation. However, when it comes to protecting electronic components, simplicity prevails with low pressure molding. This straightforward, three-step encapsulation technique offers superior resilience for electronics in various sectors, including industrial automation, automotive, medical, and lighting. By utilizing specialized polyamide hot melt materials and custom molds, low pressure molding provides quick, robust, and delicate protection without the need for high pressure. Discover how this innovative process is transforming device durability and efficiency across industries.
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