LOCTITE® ABLESTIK QMI3555

LOCTITE® ABLESTIK QMI3555 is formulated using a Polymodal Metal Flake distribution technology which utilizes a combination of specifically selected silver flakes that, in conjunction with a unique glass, maximizes adhesion to gold while simultaneously enhancing rheological properties of the paste. It is a No-Dry paste that possesses rheological properties which optimize dispensability during die attach. LOCTITE ABLESTIK QMI3555 incorporates a patented silver/vanadium glass at a metal to glass ratio of 6.5:1 by weight. The paste is completely resinless and fires into a film that provides high thermal and electrical conductivity as well as excellent initial adhesion. It is extremely resistant to degradation during temperature cycling from -65°C to + 150°C. A thin bondline combined with its excellent thermal properties make QMI3555 attractive for use in high power devices. Because of its wide processing range, one common low temperature firing profile can be used for both solder and glass sealed packages with nearly all die sizes.