LOCTITE® ABLESTIK ECF 550X

Features and Benefits

LOCTITE ABLESTIK ECF 550X, Epoxy Film, Adhesive Film
LOCTITE® ABLESTIK ECF 550X adhesive is designed for microelectronic applications which require electrical conductivity. This material exhibits conductivity in the x, y and z axes. When used for substrate attach, this adhesive film acts as an electrical ground plane.
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Technical Information

Carrier type Glass fabric
Cure schedule, @ 150.0 °C 1.0 hr.
Cure type Heat cure
Glass transition temperature (Tg) 109.0 °C
Physical form Film
Shear strength, Aluminum 2200.0 psi
Thermal conductivity 2.1 W/mK