BERGQUIST® GAP FILLER TGF 1500LVO
Features and Benefits
slide 1 of 2
This thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It offers low volatile outgassing for silicone sensitive applications.
BERGQUIST® GAP FILLER TGF 1500LVO is a 1.5 W/m-K thermally conductive, ultra-conforming, silicone-based liquid gap filler (2-part). It offers high temperature resistance and is proven to have significantly lower levels of silicone outgassing. It cures at room temperature or can be accelerated using heat, and is ideal for fragile applications or those that don't require a strong bond due to a lower level of adhesion strength.
- Thermal conductivity: 1.8 W/mK
- Low volatility for outgassing and silicone sensitive applications
- Ultra-conforming, with excellent wet-out
- 100% solids — no cure by-products
- For information on our thermal management materials' UL certifications, please refer to UL file E59150
Documents and Downloads
Looking for a TDS or SDS in another language?
Additional Documents
Technical Information
| Cure type | Heat cure |
| Flame rating | V-0 |
| Thermal conductivity | 1.8 W/mK |
| Mixed | |
| Color, Mixed | Yellow |
| Resin | |
| Color, Resin | Yellow |
| Hardener | |
| Color, Hardener | White |
BERGQUIST® GAP FILLER TGF 1500LVO
This thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It offers low volatile outgassing for silicone sensitive applications.