LOCTITE® ABLESTIK 2035SC
Características y Ventajas
This 1-part electrically non-conductive adhesive has been specially formulated for use in high throughput die attach applications. It has a fast cure at a low cure temperature.
When you’re working with dissimilar surfaces and need a non-conductive adhesive, LOCTITE® ABLESTIK 2035SC is a good choice. This 1-part adhesive is formulated for use in high throughput die attach applications, and is designed to minimize stress and resulting warpage between dissimilar surfaces. You can expect a 90-second cure at 110°C (230°F).
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Información técnica
| Aplicaciones | Unión |
| Características principales | Conductividad: Conductividad No Eléctrica |
| Coeficiente de dilatación térmica (CDT) | 54.0 ppm/°C |
| Coeficiente de dilatación térmica (CDT), Above Tg | 128.0 ppm/°C |
| Conductividad térmica | 0.35 W/mK |
| Contenido iónico extraíble, Cloruro (CI-) | 29.0 ppm |
| Contenido iónico extraíble, Potasio (K+) | 19.0 ppm |
| Contenido iónico extraíble, Sodio (Na+) | 89.0 ppm |
| Módulo de tracción, DMTA @ 25.0 °C | 68.0 N/mm² (10000.0 psi ) |
| Programa de curado, Recomendado @ 110.0 °C | 90.0 s |
| Resistencia al corte a temperatura ambiente | 25.0 kg-f |
| Resistencia al corte con calor | 7.0 kg-f |
| Temperatura de transición vítrea (Tg) | 120.0 °C |
| Tipo de curado | Curado Térmico |
| Viscosidad, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 11000.0 mPa.s (cP) |
| Índice tixotrópico | 4.2 |
LOCTITE® ABLESTIK 2035SC
This 1-part electrically non-conductive adhesive has been specially formulated for use in high throughput die attach applications. It has a fast cure at a low cure temperature.