LOCTITE® ABLESTIK 8600
Features and Benefits
This acrylate-based, thermally and electrically conductive die-attach adhesive is designed for high-reliability packaging.
LOCTITE® ABLESTIK 8600 is a silver die-attach adhesive for high-reliability package applications with medium thermal and electrical requirements. It’s compatible with Ag, PPF and Cu but not recommended for high-density matrix lead frames with more than 500 pads. It’s formulated with an acrylate-based resin, offers low bleed and cures snappy when exposed to heat.
- Compatible with Ag, PPF and Cu
- Improved JEDEC performance
- Offers low bleed
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 46.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 9.0 ppm |
| Extractable ionic content, Potassium (K+) | 9.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
| RT die shear strength | 11.0 kg-f |
| Tensile modulus, @ 250.0 °C | 2200.0 N/mm² (325000.0 psi ) |
LOCTITE® ABLESTIK 8600
This acrylate-based, thermally and electrically conductive die-attach adhesive is designed for high-reliability packaging.