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Henkel Expands Pressure-Less Sintering Die Attach Portfolio, Launches Versatile Material Ideal for Power Package Applications LOCTITE® ABLESTIK® ABP 8068TD Provides High Thermal Capability with No Requirement for Die Back-Side Metallization Read More
Innovations in Instant Adhesives & LED Light Cure Adhesives Enable faster production speeds with highly fluorescent adhesives for high speed inspection Read More
BONDERITE® Solutions from Henkel Help Automotive Suppliers to Leverage the Growth Potential in Lightweighting Metals One-stop process portfolio for all needs in metal surface treatment Read More
2018-11-30 Henkel offers a one-stop portfolio of process solutions for the global metal coil industry Focus on enhanced sustainability, greater cost-efficiency and new alloy substrates Read More
Henkel’s LOCTITE® STYCAST® OS 5101 Provides High Reliability and Robust Dimensionally-Stable Adhesion for Optical Lens and Component Bonding Dual Cure, Active Alignment Optical Adhesive Delivers High Precision Performance for Optimal Transceiver Signal Integrity Read More
Micro-Thermal Interface Material Coatings from Henkel Land Award Win, Portfolio Expansion Underway Novel Thermal Management Coatings Aid in Reducing Operational Heat in Cloud and Hyperscale Data Center Optical Transceivers Read More
Micro Thermal Interface Coating from Henkel Lowers Networking Line Card Heat for Optimized Datacenter Irvine, California – To manage the greater data bandwidth needs inherent with 4k rich media streaming, machine learning, data mining, and analytics, next-generation hyper-scale and cloud-scale datacenters are transitioning to the 400 gigabit ethernet (GbE) standard. While higher-speed switching and routing is necessary to manage 5G network traffic volumes, ensuring optimal performance through effective heat management is challenging, and conventional thermal interface materials (TIMs) for pluggable optical modules (POMs) are not ideal. Henkel has developed new micro-thermal interface coatings, the BERGQUIST® microTIM mTIM 1013 and 1029, that offer a robust heat-dissipating solution and are conducive to the operational realities of state-of-the-art datacenters. Applied to networking line card heatsinks that come in contact with POMs, BERGQUIST® microTIM mTIM 1000 series are durable, thermally conductive thin film coatings designed to... Read More
Thermal Gel from Henkel lets 5G Telecom Components go Vertical Irvine, California – As the 5G wireless broadband connection standard continues to gain traction, development and deployment of next-generation systems that can reliably manage high volumes of mobile data processing and transfer are accelerating. Working to help telecom device designers achieve critical in-field robustness and reliability, Henkel today announced the launch of a new gel thermal interface material (TIM) that can withstand the environmental and positioning demands of today’s infrastructure components. BERGQUIST® LIQUI-FORM® TLF 6000HG is a thermally conductive, dispensable, pre-cured gel that offers stable viscosity in storage and in use. The material, which can accommodate gaps up to 3.0 mm, offers production simplicity as the pre-cured formulation requires no mixing or refrigeration. Once applied, the 6.0 W/m-K TIM gel maintains its form and position, which is critical for telecom devices that may be placed vertically in outdoor environments... Read More