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LOCTITE^® ABLESTIK^® ABP 8068TD Provides High Thermal Capability with No Requirement for Die Back-Side Metallization

Enable faster production speeds with highly fluorescent adhesives for high speed inspection

One-stop process portfolio for all needs in metal surface treatment

Focus on enhanced sustainability, greater cost-efficiency and new alloy substrates

Newly launched range of adhesives and coatings enables improved packaging recycling Together with its partners ExxonMobil, Borealis and Saperatec, Henkel’s experts are excited to present their new solutions for packaging applications at the K trade fair on October 16 to 23, 2019 in Düsseldorf, Germany.

Dual Cure, Active Alignment Optical Adhesive Delivers High Precision Performance for Optimal Transceiver Signal Integrity

Novel Thermal Management Coatings Aid in Reducing Operational Heat in Cloud and Hyperscale Data Center Optical Transceivers

Irvine, California – To manage the greater data bandwidth needs inherent with 4k rich media streaming, machine learning, data mining, and analytics, next-generation hyper-scale and cloud-scale datacenters are transitioning to the 400 gigabit ethernet (GbE) standard.  While higher-speed switching and routing is necessary to manage 5G network traffic volumes, ensuring optimal performance through effective heat management is challenging, and conventional thermal interface materials (TIMs) for pluggable optical modules (POMs) are not ideal. 
 
Henkel has developed new micro-thermal interface coatings, the BERGQUIST^® microTIM mTIM 1013 and 1029, that offer a robust heat-dissipating solution and are conducive to the operational realities of state-of-the-art datacenters. Applied to networking line card heatsinks that come in contact with POMs, BERGQUIST^® microTIM mTIM 1000 series are durable, thermally conductive thin film coatings designed to...