LOCTITE® ABLESTIK ABP 8060T
Known as ABP 8060T (18G)
Features and Benefits
LOCTITE ABLESTIK ABP 8060T, BMI Hybrid, Die Attach
LOCTITE® ABLESTIK ABP 8060T is formulated to provide high heat transfer generated from power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
- Thermally conductive
- Hydrophobic
- Stable at high temperatures
- Electrically conductive
Documents and Downloads
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Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 55.0 ppm/°C |
| Cure type | Heat cure |
| Extractable ionic content, Chloride (CI-) | 9.0 ppm |
| Extractable ionic content, Potassium (K+) | 9.0 ppm |
| Extractable ionic content, Sodium (Na+) | 9.0 ppm |
LOCTITE® ABLESTIK ABP 8060T
LOCTITE ABLESTIK ABP 8060T, BMI Hybrid, Die Attach