LOCTITE® ABLESTIK ABP 8060T
被称为 ABP 8060T (18G)
功能与优点
LOCTITE ABLESTIK ABP 8060T, BMI Hybrid, Die Attach
LOCTITE® ABLESTIK ABP 8060T is formulated to provide high heat transfer generated from power devices. This material can also be used as a soft solder alternate for applications requiring high thermal and electrical conductivity.
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技术信息
| 可萃取出的离子含量, 氯化物 (CI-) | 9.0 ppm |
| 可萃取出的离子含量, 钠 (Na+) | 9.0 ppm |
| 可萃取出的离子含量, 钾 (K+) | 9.0 ppm |
| 固化方式 | 热+紫外线 |
| 应用 | 芯片焊接 |
| 热膨胀系数 (CTE) | 55.0 ppm/°C |
LOCTITE® ABLESTIK ABP 8060T
LOCTITE ABLESTIK ABP 8060T, BMI Hybrid, Die Attach