LOCTITE® ECCOBOND EN 1350

Features and Benefits

LOCTITE ECCOBOND EN 1350, Epoxy, Encapsulant
LOCTITE® ECCOBOND EN 1350 encapsulant is designed for thermal sensor assembly applications.
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Technical Information

Applications Encapsulating
Coefficient of thermal expansion (CTE), Above Tg 100.0 ppm/°C
Coefficient of thermal expansion (CTE), Below Tg 27.0 ppm/°C
Colour Black
Cure schedule, @ 120.0 °C 1.0 hr.
Cure type Heat cure
Glass transition temperature (Tg) 103.0 °C
Mix ratio, by weight 100 : 2.8
Number of components 2 part
Shelf life 183.0 day
Shore hardness, Shore D 90.0
Storage temperature 25.0 °C
Tensile modulus, DMA @ 25.0 °C 7500.0 N/mm² (1087783.0 psi , 7.5 GPa )