LOCTITE® ABLESTIK 2907

Features and Benefits

TDS Download
LOCTITE ABLESTIK 2907, Epoxy, Assembly, Bonding, Sealing or Repair
LOCTITE® ABLESTIK 2907 is designed for electronic bonding and sealing applications that require a combination of good mechanical and electrical properties. It can also be used as a "cold solder" for heat sensitive components where hot soldering is impractical.
Read More

Documents and Downloads

Technical Data Sheet
LOCTITE® ABLESTIK 2907
Download TDS

Looking for a TDS or SDS in another language?

Search for TDS in another language
Search for SDS in another language

Technical Information

Cure schedule, Recommended @ 25.0 °C 24.0 hr.
Cure type Heat cure
Number of components 2 part
Recommended for use with Ceramic
Shear strength, Aluminium 1200.0 psi
Storage temperature 27.0 °C
Thixotropic index 3.5
Mixed
Viscosity CP52, Mixed Speed 10 rpm 6500.0 mPa·s (cP)