LOCTITE ABLESTIK ABP 2100AC

Terkenal sebagai ABP-2100AC (35g)

fitur dan keuntungan

LOCTITE ABLESTIK ABP 2100AC, Proprietary Hybrid Chemistry, Die Attach
LOCTITE® ABLESTIK ABP 2100AC die attach adhesive is designed for Pb-free array packaging. This product is able towithstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.
  • Low stress
  • Low cost
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Informasi Teknis

Aplikasi Pelekat Die
Koefisien Muai Termal (CTE) 65.0 ppm/°C
Tipe Pengeringan Heat Cure