LOCTITE® ABLESTIK ABP 8068TA

LOCTITE® ABLESTIK ABP 8068TA is a semi-sintering die attach adhesive designed for semiconductor packages requiring high thermal and electrical conductivity. This material’s epoxy assisted sintering formulation is designed to provide high adhesion, high thermal and low stress properties which are essential for thermal and reliability performances of high end power packages. The thermal performance of LOCTITE ABLESTIK ABP 8068TA is comparable to a solder paste material. In conventional box oven curing, it will cure at 1 hour at 200ºC or 175ºC.