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Henkel Expands BERGQUIST® BOND-PLY® LMS-HD Portfolio with Addition of Reinforced Insulation Material New, Thicker Material Supports UL Reinforced Insulation and IEC Class II Insulation Standards, Delivers Excellent Thermal and Adhesion Performance Read More
2020-04-01 Henkel Expands Line of High Thermal Conductivity BERGQUIST GAP PAD® materials for High Power Applications Irvine, California – Henkel today announced the expansion of its award-winning thermal interface materials (TIMs) portfolio with the addition of a product developed to address the high-power density challenges associated with new 5G telecom infrastructure and consumer mobility designs. BERGQUIST GAP PAD® TGP 10000ULM is a formulation that provides exceptionally high thermal conductivity of 10.0 W/m-K within an ultra-low modulus, low assembly stress formulation. The combination of these characteristics makes the material one of the highest performing TIMs available in the market today. “Because more functional, miniaturized telecom infrastructure components are required for 5G connectivity, higher power densities will be the norm,” explains Wayne Eng, Henkel Global Head of Market Strategy, Telecom and Datacom. “Highend routers, servers, switches and base band units continue... Read More
Henkel Develops Advanced Solder Paste Test Vehicle Novel test vehicle addresses miniaturization realities. Read More
