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    Henkel Expands Line of High Thermal Conductivity BERGQUIST GAP PAD® materials for High Power Applications

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    “Because more functional, miniaturized telecom infrastructure components are required for 5G connectivity, higher power densities will be the norm,” explains Wayne Eng, Henkel Global Head of Market Strategy, Telecom and Datacom. “Highend routers, servers, switches and base band units continue...

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