BERGQUIST® GAP PAD® TGP 1000VOUSB
Known as Gap Pad® VO Ultra Soft-B
Features and Benefits
BERGQUIST GAP PAD TGP 1000VOUSB, Ultra Conformable, Viscoelastic, Electrically isolating, Thermally Conductive Material for Filling Air Gaps
BERGQUIST® GAP PAD TGP 1000VOUSB is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. BERGQUIST GAP PAD TGP 1000VOUSB is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.
- Thermal conductivity: 1.0 W/m-K
- Highly conformable, low hardness
- Decreased strain
- Puncture, shear and tear resistant
Documents and Downloads
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Additional Documents
Technical Information
| Carrier type | Fiberglass |
| Color | Black |
| Operating temperature | -60.0 - 200.0 °C |
| Standard thickness | 0.508 - 3.175 mm |
| Thermal conductivity | 1.0 W/mK |
| Young's modulus, ASTM D575 | 55.0 KPa (8.0 psi ) |
BERGQUIST® GAP PAD® TGP 1000VOUSB
BERGQUIST GAP PAD TGP 1000VOUSB, Ultra Conformable, Viscoelastic, Electrically isolating, Thermally Conductive Material for Filling Air Gaps