BERGQUIST® GAP FILLER TGF 1500LVO
Známé jako Gap Filler 1500LV
Vlastnosti a výhody
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This thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It offers low volatile outgassing for silicone sensitive applications.
BERGQUIST® GAP FILLER TGF 1500LVO is a 1.5 W/m-K thermally conductive, ultra-conforming, silicone-based liquid gap filler (2-part). It offers high temperature resistance and is proven to have significantly lower levels of silicone outgassing. It cures at room temperature or can be accelerated using heat, and is ideal for fragile applications or those that don't require a strong bond due to a lower level of adhesion strength.
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Technické informace
| Hodnocení hořlavosti | V-0 |
| Tepelná vodivost | 1.8 W/mK |
| Způsob vytvrzování | Vytvrzování teplem |
| Tužidlo | |
| Barva, Tužidlo | Bílá |
| Pryskyřice | |
| Barva, Pryskyřice | Žlutá |
| Mix | |
| Barva, Mix | Žlutá |
BERGQUIST® GAP FILLER TGF 1500LVO
This thermally conductive liquid gap filler is designed for easy, precision dispensing and low stress assembly. It offers low volatile outgassing for silicone sensitive applications.