LOCTITE® ABLESTIK 8352L-G
Features and Benefits
LOCTITE ABLESTIK 8352L-G, Epoxy, Die Attach
LOCTITE® ABLESTIK 8352L-G die attach adhesive is designed for high reliability packaging applications. This product is particularly suitable for packages in which tight control of resin bleed out or kerf creep is required.
- Electrically conductive
- Low stress
- Use for wide range of package sizes
- Excellent adhesion to copper
Documents and Downloads
Looking for a TDS or SDS in another language?
Technical Information
| Applications | Die attach |
| Coefficient of thermal expansion (CTE) | 76.0 ppm/°C |
| Coefficient of thermal expansion (CTE), Above Tg | 191.0 ppm/°C |
| Cure type | Heat cure |
| Glass transition temperature (Tg) | 31.0 °C |
| Thixotropic index | 5.7 |
| Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm | 9430.0 mPa·s (cP) |
LOCTITE® ABLESTIK 8352L-G
LOCTITE ABLESTIK 8352L-G, Epoxy, Die Attach