LOCTITE® ABLESTIK 8352L-G

Features and Benefits

LOCTITE ABLESTIK 8352L-G, Epoxy, Die Attach
LOCTITE® ABLESTIK 8352L-G die attach adhesive is designed for high reliability packaging applications. This product is particularly suitable for packages in which tight control of resin bleed out or kerf creep is required.
  • Electrically conductive
  • Low stress
  • Use for wide range of package sizes
  • Excellent adhesion to copper
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Technical Information

Applications Die attach
Coefficient of thermal expansion (CTE) 76.0 ppm/°C
Coefficient of thermal expansion (CTE), Above Tg 191.0 ppm/°C
Cure type Heat cure
Glass transition temperature (Tg) 31.0 °C
Thixotropic index 5.7
Viscosity, Brookfield CP51, @ 25.0 °C Speed 5 rpm 9430.0 mPa·s (cP)